Special Topics

Organizers: Dan Ewing and Chris Roberts

Abstract: This special session will focus on the material interfaces, assembly processes, and system properties of advanced packaging and heterogeneous integration methods. Technologies such as interposers, heterogeneous integration and wafer level packaging have the ability to reduce packaging length scales and resulting in improvements in the size, weight and power of microelectronics systems.  Significant materials challenges still need to be met, including integrating dissimilar materials, interconnect metals, die attach methods, and thermal mitigation.  The application space includes 2.5D interposers and 3D chip stacking, heterogeneous integration of compound semiconductors, and devices and interconnects for cryogenic temperatures.

Organizers: Dan Ewing and Chris Roberts

Abstract: This special session will focus on direct write electronics, and the underlying process/structure/property/performance relationship for printed electronic materials. Utilizing additive manufacturing or direct write printing techniques to fabricate functional electronic devices has a range of benefits not easily achieved with conventional processing. These benefits include compatibility with a variety of substrates, including soft/polymer substrates, direct fabrication on curved or non-planar substrates, incorporation of functional materials such as nanoparticles, mass customization, and rapid prototyping. There are many material-related challenges to be addressed in printed electronics, including optimization of materials and inks used in the printing process, various printing parameters, process repeatability, resulting material structure, and related electrical and mechanical properties.

Organizers: Sadhvikas Addamane

Co-Organizers: Remi Dingreville & Saaketh Desai, Sandia National Laboratories

Abstract: This session will  explore the transformative role of artificial intelligence and machine learning in materials discovery.  Specifically, we will look at AI/ML techniques that are proving essential in accelerating the identification, characterization, and optimization of novel materials for electronic applications. Leading researchers and industry experts will present their latest findings, showcasing innovative algorithms, data-driven methodologies, and real-world case studies that illustrate the potential of AI/ML to enhance material performance and reliability. 

Invited Speakers:

Prof. Aditi S Krishnapriyan - UC Berkeley

Prof. Sterling Baird - University of Toronto

Prof. Dallas Trinkle - University of Illinois, Urbana-Champaign

Dr. Lane Schultz - Sandia National Laboratories 

Organizers: Sadhvikas Addamane and Gunny Balakrishnan

Co-Organizer: Han Htoon, Los Alamos National Laboratory

Abstract: This session will explore the synthesis and characterization of a wide range of quantum emitters and single photon sources including semiconductor quantum dots, defect centers, and carbon nanotubes.

Invited Speakers:

• Dr. Zixuan Wang - National Institute of Standards and Technology
• Dr. Andrew Mounce - Sandia National Laboratories
• Prof. Tongcang Li - Purdue University
• Prof. YuHuang Wang - University of Maryland 
• Dr. Huan Zhao - Oak Ridge National Laboratory

Session Organizer: Dr. Pawan Tyagi

Abstract: This session will explore the forefront of molecular-scale electronics and spintronics, examining both fundamental discoveries and the pathways toward real-world application. As researchers look beyond CMOS technologies, molecules and their intrinsic quantum and spin properties offer a compelling alternative for next-generation devices. This session brings together leading experts to discuss advances from single-molecule break-junction studies to device architectures compatible with scalable manufacturing.